银汞合金联合树脂黏结系统充填窝洞的扫描电镜观察

A scanning electron microscope study on resin bonding amalgam restoration in cavity

目的:通过扫描电镜观察银汞合金-树脂黏结剂黏结充填的窝洞,评价银汞合金黏结修复体的黏结界面情况。方法:65颗健康离体牙,分为对照组(5颗),采用常规银汞合金充填法;实验组(60颗),分别使用3种树脂类黏结剂黏结充填。场发射扫描电镜观察黏结界面。结果:实验组银汞合金充填体和牙体的结合面能够被树脂类黏结剂封闭,黏结剂能够与牙釉质、牙本质和银汞合金形成黏结,并可以封闭牙本质小管。自固化黏结剂的黏结完整性优于光固化黏结剂。结论:银汞合金联合通用黏结体系可以封闭银汞合金充填体结合界面,减少继发龋的形成。

PURPOSE： To detect the bonding interface of resin bonding amalgam restoration（BAR） with scanning electron microscope（SEM）.METHODS： Sixty-five healthy teeth were divided into 4 groups,including one control group（5 teeth） with regular amalgam restoration and 3 experimental groups（20 teeth each） with 3 kinds of resin bond agent.The section was detected with SEM to evaluate the resin-bonding-amalgam interface.RESULTS： The resin bonding agent could fulfill the micro-leakage between amalgam and enamel or dentin,and seal the dentin tubules completely.The resin bonding agent could bond enamel,dentin and amalgam well.The chemical curing agent had a better effect than the light curing agent.CONCLUSIONS： BAR reduces the micro-leakage around amalgam restoration and provides a better way to prevent secondary caries.