乙醇酸络合剂电镀Ni-W合金工艺探究

Process Conditions of Ni-W Alloys Electro Deposition with Glycolic Acid as Complexing Agent

电镀Ni-W合金常使用柠檬酸或其盐为络合剂.文中采用极少应用的乙醇酸络合剂制备了Ni-W合金镀层,研究了镀液组成和操作条件对镀层组成及显微硬度的影响.结果表明:钨含量对镀层显微硬度起决定作用,而镀液中Na2WO4浓度和电流密度会显著影响镀层中的钨含量,进而影响镀层的显微硬度,镀层的显微硬度最高可达615HV.通过正交实验得出适宜工艺条件为:NiSO4.6H2O12g/L,Na2WO4.2H2O 48g/L,C2H4O3.2 H2O 60g/L,pH6.5,镀液温度70℃,电流密度1.8A/dm2.

The citric or citrate are usually used as complexing agent to electroplate Ni-W alloys.In this thesis,Ni-W alloys were electroplated with the glycolic acid that rarely used.The influence of composition of electrolyte and operating conditions were discussed.Through the investigation and analysis,the following could be concluded： The tungsten content is the most crucial factor to the micro hardness of Ni-W alloys.The effect of the Na2WO4·2H2O content in electrolyte and the cathode current density on the composition of Ni-W alloys is the most obvious.The highest micro hardness of Ni-W alloys can reach 615HV.