热泄漏对平板型环路热管传热特性的影响

HEAT LEAK EFFECTS ON THE HEAT TRANSFER PERFORMANCE OF A FLAT LOOP HEAT PIPE

环路热管由于其出色的传热性能,正在成为高热流密度电子芯片散热的前沿技术。本文制作了一种以铜为外壳、水为工质的大功率平板式环路热管,并研究了热泄漏对环路热管传热特性的影响。通过降低毛细结构的等效热导可以有效降低热泄漏,使环路热管有更好的传热性能。结果显示,本文所制环路热管在传达距离为80 cm的时候,最大功率可达150 W以上,此时热阻约为0.08℃/W。最低启动功率为2 W,不存在启动困难的问题。

Loop heat pipes now become the front technology for the high heat flux thermal cooling as its excellent heat transfer performance. In this paper, we manufactured a loop heat pipe with flat evaporator, using copper as shell and ultra pure water as the working fluid. The heat leak effects on the heat transfer performance of a loop heat pipe had been studied experimentally. Reducing the equivalent thermal conductivity of the wick material can reduce the heat leak, by which the loop heat pipe gives better performance. Results show that, the loop heat pipe with flat evaporator can transfer 150 W to a distance of 80 cm with thermal resistance of 0.08℃/W. The lowest start power is 2 W in the test, and the loop heat pipe can start up easily.