摘要
介绍了一种半导体焊盘(PAD)与衬底(SUBTRATE)之间的漏电流检测的方法,这种漏电流检测的目的是为了判断芯片管脚是否完好地连接在引脚上。它的特点是数字化接口和快速高效的处理能力,可以在数毫秒之内完成IC芯片的管脚到衬底之间的漏电流甚至漏电容检测。系统用数字电路以嵌入式单片机为核心,模拟电路以运放和检测电路组成,是一个独立的开放式架构,可以和带有RS422/485接口的任何计算机或控制器通信,且可在线编程以便工艺参数修改。
This paper introduced a method of leak current detection between pad and substrate, which is aimed to estimate a successful bonding for the bonded device. Features of the method including digital interface and efficient data processing could enable the leak current detection even leak capacitor detection to be finished in several milliseconds. The digital part of this detection system is central of embedded Micro-processor while the analog part is made up of operation amplifier and detection circuit. The system is an independent and open structure, and could communicate with any computers or controllers, which have RS422/485 port, in order to set up and modify the processing parameters.
出处
《电子工业专用设备》
2010年第8期45-48,共4页
Equipment for Electronic Products Manufacturing
关键词
焊盘
衬底
漏电流检测
控制器
Pad
Substrate
Leak current detection
Controller
