乙醛酸、葡萄糖用于Q235钢酸性化学镀铜的电化学分析

Electrochemical analysis of acidic electroless copper plating on Q235 steel using glyoxylic acid and glucose

以乙醛酸为还原剂,葡萄糖为促进剂,在Q235钢上进行了酸性化学镀铜。研究了乙醛酸和葡萄糖对镀层的影响。结果表明:在乙醛酸和葡萄糖的共同作用下,Q235钢化学镀铜层的光亮度提高,厚度符合标准,结合力好。乙醛酸和葡萄糖的最佳添加量分别为70mL/L和60g/L。

The acidic electroless copper plating on Q235 steel was carried out with glyoxylic acid as reducing agent and glucose as accelerator. The effects of glyoxylic acid and glucose on deposit were studied. The results showed that the brightness of the deposit is improved, the thickness measures up to the standard and the electroless copper coating has good adhesion under the combined effect of glyoxylic acid and glucose. The optimal addition of glyoxylic acid and glucose is 70 mL/L and 60 g/L, respectively.