摘要
研究了采用脉冲电源电镀法制备泡沫铜。以聚氨酯泡沫为基体，经过粗化、活化、化学镀铜工艺在聚氨酯泡沫上化学镀铜，随后采用脉冲电源作为电镀电源，在占空比10％～40％、频率100～200Hz、电流密度80-350A／m^2条件下制备泡沫铜。
Preparation of foam copper by pulse power source electroplating has been studied. After elec-troplating copper on polyurethane foam base body by roughening, sensitization, activation and chemical deposition process, then foam copper can be preparaed by pulse power source at the conditions of duty cycle of 10-40%,frequency of 100-200 Hz and current density of 80-350 A/m^2.
出处
《湿法冶金》
CAS
北大核心
2010年第3期176-177,共2页
Hydrometallurgy of China
关键词
脉冲电镀
聚氨酯
泡沫铜
制备
pulse plating
polyurethane
foam copper
preparation
