摘要
对Ni—SiC体系的复合电镀的电沉积机理进行了探讨和研究，并提出一套求动力学参数的方法，经实验证实，理论推导与实验结果相符。
The sediment mechanism of compound plating of Ni-SiC system is discussed. The methodsto seek for kinetic parameters are brought forth. It proves that the experimental results are the same withthe theoretical reasoning.
