高性能印刷电路板用氰酸酯树脂研究进展

Development of High Performance Cyanate Ester Resin Used in Printed Circuit Boards

综述了国外高性能印刷电路板用氰酸酯树脂研究的新进展,包括催化剂对双氰酸酯单体发生环化三聚反应形成三嗪环的高度交联网络结构的大分子-三氮杂苯氰酸酯树脂的影响、氰酸酯树脂的增韧、氰酸酯树脂的湿/热性能、新型氰酸酯单体的合成及其树脂的性能等。氰酸酯单体的固化受催化剂的影响,催化剂能促进固化反应,又能降低氰酸酯树脂的湿/热性能。氰酸酯树脂的增韧改性包括共混增韧改性和化学增韧改性。氰酸酯树脂表现出热突变效应和反转热效应的湿/热性能特征。新型氰酸酯单体的合成及其树脂的发展方向是进一步提高氰酸酯树脂的热性能和加工性能并降低其成本。

Some new developments of high performance cyanate ester resin used in printed circuit boards were reviewed,including the effects of catalyst on the cyclotrimeri-zation of cyanate monomers,toughness enhancement and wet/thermal properties of poly（cyanate ester） net andsynthesis of novel cyanate ester resin.The cyclotrimerization of cyanate monomers is catalyst-dependent.Compounding of cyanate ester resin with other polymer or chemical modificaton of cyanate ester monomer resulted in enhancement in toughness of poly（cyanate ester） net.The wet/thermal properties of poly（cyanate ester） net show thermal spikes and reverse thermal effect.New cyanate monomers and poly（cyanate ester） net are being developed for the sake of increasing the thermal and processing property of poly（cyanate ester） net as well as reducing its cost.