摘要
文章着重讲述在刚挠结合板制作过程中,外层为挠板结构设计的刚挠结合板线路及通孔铜厚的实现方法,以及制作过程中制作难点和易产生缺陷的解决途径。
This paper focuses on the Rigid-flex board production process, the design of using flexible outer layer and the realization of copper thickness in through hole, and the difficulties encountered in conventional production processes as well as defect solutions.
出处
《印制电路信息》
2010年第9期34-36,共3页
Printed Circuit Information
关键词
刚挠结合板
非对称结构
激光直接成像
覆盖膜
rigid-flex PCB
non-symmetrical structure
LDI（Laser Direct Imaging）
coverlay
