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应用LCP基材低成本化挠性RF电子元器件与天线 被引量:1

The Solution for Low-cost RF Flexible Electronics and Antennas with Liquid Crystal Polymer(LCP)
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摘要 液晶聚合物(LCP)是一种低成本的热塑性有机材料,因具有恒定介电常数、稳定热学与化学稳定性等优良性能[1]-[3],可低成本应用于RF、微波、毫米波等无线通信、电子元器件封装与挠性天线基材等领域[4]-[5]。介绍了LCP基材在无源电阻元器件、双频滤波器与RFID天线等应用,三者的模拟仿真与实际测量结果均表现良好的一致性。 Liquid Crystal Polymer(LCP) is a low-cost thermoplastic organic material. LCP can be applied in the RF/microwave/millimeter(mm) wave regimes of wireless communication, electronics and antennas for the good performance of constant relative dielectric coefficient, excellent thermal and chemical stability. Embedded passives, dual band filters and RFID antennas, fabricated with LCP substrate are introduced with good agreement between the simulated and measured results over their respective bandwidths.
出处 《印制电路信息》 2010年第9期37-40,共4页 Printed Circuit Information
关键词 LCP 无源元器件 双频滤波器 RFID天线 LCP embedded passives dual band filter RFID antenna
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参考文献5

  • 1V. Palazzaril, D. Thompson, N. Papageorgiou, et al. Multiband RF and mm-Wave Design Solutions for Integrated RF Functions in Liquid Crystal Polymer System-On- Package Technology[C]. 2004 Electronic Components and Technology Conference, 2008:1658-1663.
  • 2Jun Young Kim, Seong Hun Kim, Influence of viscosity ratio on processing and morphology of thennotropic liquid crystal polymer-reinforced poly(ethylene 2,6-naphthalate)bl ends[J]. Polymer Intemational, 2006, 55:449-455.
  • 3D.C.Thompson, O.Tantot, H. Jallageas, et al. Characterization of Liquid Crystal Polymer (LCP) Material and Transmission Lines on LCP Substrates from 30-110 GHz[J]. IEEE Trans. Microwave Iheory Tech, 2004, 52: 1343-1352.
  • 4George E. Ponchak, Jennifer L. Jordanl, Stephen Horst et al. RF and DC Power Handling Characterization of Thin Film Resistors Embedded on LCP[C]. 2008 Electronic Components and Technology Conference, 2008:713-717.
  • 5Jun Young Kim, Seong Hun Kim. Structure and Property Relationship of Thermotropic Liquid Crystal Polymer and Polyester Composite Fibers[J]. Journal of Applied Polymer Science, 99, 2006: 2211-2219.

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