摘要
比较了含镶嵌晶粒铜双晶体及其基体单晶体的循环变形行为，结果表明，双晶体的循环应力总是高于基体单晶体，结合表面滑移形貌和饱和位错组态，分别讨论了镶嵌晶粒和环绕晶界对双晶体循环变形行为的影响．
Cyclic deformation behaviors of a copper bicrystal with an embedded grain and its matrix single crystal were compared. It was found that cyclic stress of the bicrystal is always higher than that of the matrix single crystal and increases with increasing strain amplitude. Combing with the surface slip morphology and dislocation patterns, effects of the embedded grain and the surrounding grain boundary on cyclic deformation of bicrystal were discussed.
出处
《金属学报》
SCIE
EI
CAS
CSCD
北大核心
1999年第7期715-720,共6页
Acta Metallurgica Sinica
基金
国家自然科学基金!59701006
19392300-4
辽宁省博士启动基金
关键词
铜双晶体
循环变形
镶嵌晶粒
晶界
滑移形貌
copper bicrystal
cyclic deformation
embedded grain
grain boundary
slip morphology
dislocation pattern
