摘要
倒装焊的底部填充属非气密性封装,并且受倒装焊凸点焊料熔点、底部填充有机材料耐温限制,使得倒装焊器件的密封结构设计和工艺设计受限。文章结合气密性器件使用要求,设计了两种不改变现行倒装焊器件制造工艺、器件总体结构[3]的密封技术,经过分析论证以及工艺实验,确认其是可行的。密封的器件能够满足MIL-883G中有关气密性、内部水汽含量、耐腐蚀(盐雾)、耐湿以及机械试验等[6~7],密封结构、密封工艺均是在现有封装工艺条件基础上进行,具有非常强的可行性。
Flip-chip packaging ofunderfill was non-hermetic packaging. By the limit of organic material's temperature resistance of underfill and bump material's melting, flip-chip hermetic structure design and technology were restricted. In this paper, in base of hermetic device's demand and existing flip-chip technology and structure, two types structure was designed. The structure was feasible by the process test and analysis. The hermetic packaging device satisfied the standard MIL-883G of air-tightness, water vapor content, corrosion (salt atmosphere), moisture resistance and mechanical test. Hermetic device and hermetic technology were feasible in the base of existing packaging technology.
出处
《电子与封装》
2010年第9期1-4,共4页
Electronics & Packaging
关键词
倒装焊
气密性
陶瓷外壳
平行缝焊
合金焊料熔封
可靠性
flip chip
air-tightness
ceramic package
parallel seam welding
solder sealing
reliability