倒装焊器件的密封技术

Hermetically Sealed Construction and Technology of Flip-chip Device

倒装焊的底部填充属非气密性封装,并且受倒装焊凸点焊料熔点、底部填充有机材料耐温限制,使得倒装焊器件的密封结构设计和工艺设计受限。文章结合气密性器件使用要求,设计了两种不改变现行倒装焊器件制造工艺、器件总体结构[3]的密封技术,经过分析论证以及工艺实验,确认其是可行的。密封的器件能够满足MIL-883G中有关气密性、内部水汽含量、耐腐蚀（盐雾）、耐湿以及机械试验等[6~7],密封结构、密封工艺均是在现有封装工艺条件基础上进行,具有非常强的可行性。

Flip-chip packaging ofunderfill was non-hermetic packaging. By the limit of organic material＇s temperature resistance of underfill and bump material＇s melting, flip-chip hermetic structure design and technology were restricted. In this paper, in base of hermetic device＇s demand and existing flip-chip technology and structure, two types structure was designed. The structure was feasible by the process test and analysis. The hermetic packaging device satisfied the standard MIL-883G of air-tightness, water vapor content, corrosion （salt atmosphere）, moisture resistance and mechanical test. Hermetic device and hermetic technology were feasible in the base of existing packaging technology.