微电子器件温度分布测试技术研究

Study on Temperature Distribution Measurement of Microelectronic Devices

为改善微电子器件性能,提高可靠性,确定筛选、考核条件等都必须对器件的结温、表面温度分布以及热斑等热特性进行精确测量,红外热像法是当前测量微电子器件热特性最有效的方法之一。文章针对InfrascopeⅡ型显微红外热像仪在实际应用中如何提高其测温准确度和一致性等问题进行了研究,重点分析了样品发射率、背景环境和大气衰减等因素的影响,并给出验证解决方案,取得了满意的结果。

To improve the microelectronic devices＇ performance and reliability, definitude the screening and aging terms, we need to make accurate measurement on the junction temperature, surface temperature distribution, hot spot and other performance of the microelectronic devices. Currently, one of the most effective ways to measure temperature distribution of microelectronic devices is infrared thermal imaging method. This article has done some research on how to improve the veracity and consistency of the measured temperature during the actual application of infrascope Ⅱ infrared thermal microscope, and focus on the analysis of influence the sample emissivity, background environment and atmospheric attenuation and other factors, then brought forward the solution with a satisfactory result.