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舰船微电子器件进货检验方案及流程浅析

A Brief Analysis of the Inspection Measures and Procedures for Warship-loaded Micro-electronic Components
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摘要 文章介绍了用于舰船设备的微电子器件现状,包括类型、质量等级、用途等,并简要分析所生产的船用设备中的微电子器件的质量状况,以此为前提并根据船用设备的特点,浅析微电子器件的进货检验方案,并论述进货检验中各个流程的目的,以及改进措施。 The study mainly introduces the current status of micro-electronic components loaded on naval vessels or warships, specifically, their types, quality levels and functions, etc. and provides a brief account of the quality conditions for domestic micro-electronic products intended for ships, based on which, the methods of inspection on purchase of these manufactures are identified and each procedure required for such inspection is explored in terms of its respective purpose and possible improvement.
作者 李靖 肖莹
出处 《计算机与数字工程》 2010年第9期117-119,173,共4页 Computer & Digital Engineering
关键词 微电子器件 质量状况 micro-electronic components, quality conditions
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参考文献5

  • 1GJB597A 半导体集成电路总规范.
  • 2IPC/JEDEC J-STD-020,2004.
  • 3IPC/JEDEC J-STD-033B,2004.
  • 4PL.马丁.电子故障分析手册[M].北京:科学出版社,2005:16-24.
  • 5GJB179A 计数抽样检查程序及表,1996.

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