摘要
针对大功率半砖模块高功率密度、高可靠性的发展趋势,对半砖模块电源的散热进行探讨。文中分析了半砖模块电源的发热器件的特性,给出了三种散热设计方案,并对三种方案的工艺、成本、散热性能等进行了对比。
Aiming at the developing trends of high power half brick module power supply, the paper analyzed the cooling issuses and the thermal characteristic of the heat dissipated components. Three kinds of thermal design solution are presented and their technology, cost, performance etc. are discussed and compared.
出处
《电源世界》
2010年第9期28-31,共4页
The World of Power Supply
关键词
半砖模块电源
散热设计
铝基板
工艺
Half brick module power supply, Thermal design, MCPCB, Technology