摘要
在具有完整电源/地平面的多层印制电路板(PCB)中,其中的两层或多层金属层可能会形成有害的谐振腔,并影响系统的信号完整性.首先给出这种谐振腔的简化解析模型和基于时域有限差分(FDTD)算法的数值模型.利用数值模型研究参考平面转换时谐振模式、通孔方式、去耦电容对信号传输质量的影响.结果表明,多层PCB中信号完整性与谐振腔的场分布和通孔位置密切相关;去耦电容并不能提高信号质量,而是会引入更多的谐振点.
Unwanted resonant cavity may be formed in two or multi-metal layer of multi-layer PCB which have power/ground plane pair.This cavity may affect the signal integrity of system.First,a simplified analytical model and numerical model based on FDTD is presented.The impact of cavity resonance,different vias distribution and decoupling capacitors on signal integrity is researched by numerical model.The results show that the signal integrity is closely related to field distributon and vias positions in multi-layer PCB.The decoupling capacitors introduce more resonance instead of improving signal transmission quality.
出处
《厦门大学学报（自然科学版）》
CAS
CSCD
北大核心
2010年第5期627-630,共4页
Journal of Xiamen University：Natural Science
关键词
高性能计算机系统
信号完整性
谐振模式
去耦电容
high performance computer system
signal integrity
resonant mode
decoupling capacitor
