SiC颗粒影响SiC_p/Cu复合材料物理性能的研究

Effects of SiC particle on physical properties for SiC p/Cu composites

运用多元回归分析方法，研究了ＳｉＣ颗粒含量、粒度及纯度对ＳｉＣｐ／Ｃｕ复合材料热膨胀系数和导热率的影响规律。研究表明，影响材料热膨胀系数和导热率的主要因素为ＳｉＣ颗粒含量。随着ＳｉＣ颗粒含量的增加，复合材料的热膨胀系数和导热率降低；ＳｉＣ颗粒越小，热膨胀系数越低，而导热率越好；适当增加杂质含量有利于获得较高的导热率。

Multiple regression analyses were formulated to explore the influence mechanism on the coefficient of thermal expansion and thermal conductivity of the SiC p/Cu composites by three deterministic factors, which were content, granularity and purity of the SiC particles. The results revealed that the key factor to affect coefficient of thermal expansion of the composites was the content of the reinforcements. The coefficient of thermal expansion and thermal conductivity of the composites decreased with the increase of SiC particles. However, small reinforcements lead to decreased thermal expansion coefficient and increased thermal conductivity . Higher thermal conductivity can also be obtained by proper impurity in the composites.