摘要
综述了树脂基复合材料固化过程中温度场的影响因素及国内外的研究进展,指出温度场研究中存在的问题并对未来的研究进行了展望。
The factors affecting the temperature field in curing process of composite and the research progress at home and abroad are reviewed,and the problems exited in the research are pointed out and the next research work is prospected.
出处
《工程塑料应用》
CAS
CSCD
北大核心
2010年第8期85-88,共4页
Engineering Plastics Application
关键词
复合材料
固化过程
温度场
composite
curing process
temperature field
