摘要
本文对几种常用陶瓷-金属封接强度的测试方法进行了理论分析和测试实验,并且进行数据的统计,评价陶瓷-金属封接件的强度大小和离散性,分析了各种测试方法的优缺点,以期给陶瓷-金属封接技术的研究提供以一定的参考。
Theoretical analysis and test experiment of several common used methods of strength testing ceramic to metal seal were carried out. At the same time, data statistics were done to evaluate the magnitude of bonding strength and its decentralization. Then it was shown that each testing method had its advantage and shortcoming. It was hoped that this paper could give some reference to the specialists in the field of ceramic to metal seal.
出处
《真空电子技术》
2010年第4期39-42,46,共5页
Vacuum Electronics
关键词
封接强度
测试
韦伯模数
Seal strength, Testing, Weibull parameter
