摘要
以吩噻(OSP)、对苯二甲酰氯(TPC)和二苯醚(DPE)为单体,在无水AlCl3/CH2ClCH2Cl/DMF催化剂/溶剂体系中,由亲电缩聚反应合成了含稠杂环结构的聚醚酮酮共聚物,并对其基本性能进行了测定。结果表明,含OSP结构单元PEKK的Tg比全对苯基位PEKK高42℃以上。且随OSP结构单元含量的增加,共聚物Tg逐渐提高,而Tm、结晶度却逐渐下降,仍具有很好的耐热性和耐溶剂性。
A series of novel poly(aryl ether ketone ketone)copolymers containing heterocyclic fused ring is synthesized by electrophilic copolycondensation of phenoxathiin(OSP),terephthaloyl chloride(TPC)and diphenyl ether(DPE)in 1,2dichloroethane and in the presence of DMF and AlCl3.Properties of the copolymers are studied by DSC,WAXD,etc.With the increasing of OSP content,the Tg of the copolymer (about 42 higher than that of all paralinked PEKK)increases,the Tm and the crystallinity of the copolymer decrease. The copolymer is endowed with good heatresistance and solvent resistance.
出处
《中国塑料》
CAS
CSCD
北大核心
1999年第5期27-30,共4页
China Plastics
基金
江西省自然科学基金
关键词
聚醚酮酮
吩噻恶
亲电聚合
稠杂环结构
Poly(aryl ether ketone ketone),Phenoxathiin,Electrophilic polymerization