摘要
综述了用功能性聚硅氧烷对环氧树脂封装料进行改性从而实现环氧封装料低应力化的几种方法；并对改性后封装料的结构、热性能和机械性能作了详细介绍。
By modifing epoxy resin with functional polysiloxane,the reduction of the internal stress of encapsulant made from polysiloxanemodified epoxy was realized.The thermal and mechanical properties of the modified epoxy encapsulant were introduced.
