MEMS层叠式硅基微带天线设计与仿真

Design and Simulation of Stacked Silicon-Based MEMS Microstrip Anntenna

针对引信设计中的天线小型化问题,设计了一种易于与集成电路集成的硅基层叠式微带贴片天线.该天线的设计结合MEMS工艺,通过在硅介质中增加空气腔结构和改变同轴线内导体芯径的途径,改善了微带天线介质基板的等效介电常数和天线的阻抗特性,有效地增大了天线的带宽.HFSS仿真结果表明,与未采用空气腔结构和改变同轴线内导体芯径的普通硅基微带贴片天线相比,MEMS层叠式硅基微带天线的相对带宽由4%增加到18.4%(驻波比VSWR<2),达到了引信设计的性能要求.

A stacked silicon-based MEMS microstrip antenna which can be integrated on the IC easily was designed for fuze miniaturized application.By using MEMS technology,the bandwidth of the antenna has been effectively improved since the microstrip antenna′s equivalent dielectric constant of dielectric substrate and impedance characteristic are improved by increasing the air cavity in silicon medium and changing the coaxial line conductor core diameter.Compared with the ordinary silicon microstrip patch antenna without the air cavity structure and the change of the coaxial line conductor core diameter,the simulation results through HFSS software indicate that the bandwidth of the microstrip antenna has been increased from 4% to 18.4%（VSWR〈2） and meets the performance requirements of the fuze.