期刊文献+

纯铜钎料用于透氧膜陶瓷与不锈钢支撑体之间的封接 被引量:2

Pure Cu braze for sealing oxygen-permeable membrane ceramics and stainless steel support
下载PDF
导出
摘要 采用纯铜钎料用于透氧膜与不锈钢支撑体之间的封接,测试了纯铜钎料、透氧膜与不锈钢支撑体三者的热膨胀系数,研究了透氧膜与纯铜钎料在空气中钎焊后封接界面的形貌,以及钎焊接头在氧化/还原双重气氛下的密封性和稳定性。结果显示,在30~1000℃范围内,三者的热膨胀系数比较接近。封接后纯铜钎料与透氧膜连接界面无裂纹等缺陷,在透氧膜一侧生成一层由Cu扩散所致的厚度约为350μm的反应层。875℃透氧10h封接部位没有泄漏发生,透氧膜一侧的反应层厚度基本不变。 Pure Cu braze was used to seal oxygen-permeable membrane ceramics and stainless steel support.The thermal expansion coefficients of Cu braze,oxygen-permeable membrane and stainless steel were tested.The interfacial morphology of oxygen-permeable membrane and Cu braze after brazing in air was observed.The hermeticity and stability of joint were investigated during oxygen permeating.The results show that their thermal expansion coefficients are similar.No cracks have been found at the interface of Cu braze and oxygen-permeable membrane after brazing.A reaction layer due to Cu diffusion on the membrane side has been observed and the thickness of this reaction layer is about 350 μm.The jointing interface is gas-tight after oxygen permeating for 10h and the thickness of reaction layer on the BCFNO side keeps invariable.
出处 《功能材料》 EI CAS CSCD 北大核心 2010年第9期1540-1542,1546,共4页 Journal of Functional Materials
基金 国家高技术研究发展计划(863计划)资助项目(2006AA11A189) 上海市科学技术委员会资助项目(07DZ12036,08DZ12064) 上海市博士后资助项目(D10011009023)
关键词 纯铜钎料 透氧膜 封接 界面形貌 pure Cu braze oxygen-permeable membrane sealing interfacial morphology
  • 相关文献

参考文献1

二级参考文献28

  • 1宋红章,杨德林,胡婕,郝好山,胡行.混合导电体Y_(1-x)La_xBa_2Cu_3O_(7-δ)透氧膜的透氧性能研究[J].无机材料学报,2006,21(1):199-203. 被引量:4
  • 2谭小耀,孟波,杨乃涛.陶瓷中空纤维透氧膜的制备与性能[J].无机材料学报,2006,21(1):245-249. 被引量:8
  • 3Teraoka Y, Zhang H M, Furuka S, et al. Chem. Lett.,1985, 11 (14): 1743 -1746.
  • 4Chen C S, Liu W, Xie S, et al. Adv. Mater., 2000, 12 (15): 1132-1134.
  • 5Balachandran U, Dusek J T, Maiya P S, et al. Catal. Today, 1997, 36 (3): 265-272.
  • 6Yi J X, Zuo Y B, Liu W, et al. J. Membr. Sci., 2006, 280 (1-2): 849-855.
  • 7Chen C S, Feng S J, Ran S, et al. Angew. Chem. Int. Ed., 2003, 42 (42): 5196-5198.
  • 8Wu Z T, Jin W Q, Xu N P. J. Membr. Sci., 2006, 279 (1-2): 320-327.
  • 9Li S G, Jin W Q, Huang P, et al. AIChE J., 1999, 45 (2): 276-284.
  • 10Pei S, Kleefisch M S, Kobylinski T P, et al. Catal. Lett., 1994, 30 (1-4): 201- 208.

共引文献5

同被引文献26

  • 1Sunarso J, Baumann S, Serra J M, et al. Mixed ion ic electronic conducting ( MIEC ) ceramic-based mem branes for oxygen separation [J]. J Membr Sci, 2008, 320(1-2) :13-41.
  • 2Dabbarh S, Pfaff E, Ziombra A, et al. Brazing of MIEC ceramics to high temperature metals [J]. Ceramic Trans- actions, 2010, 215:213-223.
  • 3Hardy J S, Kim J Y, Weil K S. Joining mixed conducting oxides using an air-fired electrically conductive braze[J]. J Electrochem Soc, 2004, 151(8): 43-49.
  • 4Fergus J W. Sealants for solid oxide fuel cells [J]. Jour- nal of Power Sources, 2005, 147(1-2): 46-57.
  • 5Kim J H, Yoo Y C. Bonding of alumina to melals with Ag-Cu-Zr brazing alloy [J]. J Mater Sei Lett, 1997, 16 (14) : 1212-1215.
  • 6Arroyave R, Eagar T W. Metal substrate effects on the thermochemistry of active brazing interfaces[J]. Aeta Mater, 2003, 51(16):4871-4880.
  • 7Zhu M, Chung D D L. Active brazing alloy containing carbon fibers for metal ceramic joining [J]. J Am Ceram Soc, 1994, 77(1):2712 - 2720.
  • 8Rice J P, Paxton D M, Weil K S. Oxidation behavior of a commercial gold-based braze alloy for ceramic-to-metal joining [C]. Westerville OH: Proceedings of the 26th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures, American Ceramic Society, 2008. 809-816.
  • 9Well K S, Kim J Y, Hardy J S. lnterfacial analysis of (La0.6Sr0.4) (Co0.2Fe0.8)03 e substrates wetted by Ag- CuO [J]. J Mater Sci, 2005, 40 (9-10) :2341-2348.
  • 10Weil K S, Coyle C A, Hardy J S, et al. Alternative pla- nar SOFC sealing concepts [J]. Fuel Cells Bulletin, 2004, 5:11-16.

引证文献2

二级引证文献3

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部