加载速率对SnAgCu钎焊接头抗剪强度的影响

Effect of loading rate on shear strength of SnAgCu solder joint

研究了加载速率对SnAgCu(SAC)无铅钎料钎焊接头抗剪强度和断裂模式的影响,试验钎料的Ag元素含量为1%～3%(质量分数),微拉剪接头的加载速率为0.01～10mm/s.结果表明,当加载速率小于1mm/s时,抗剪强度随加载速率的增大而增大,断裂模式为发生在接头钎料内部的延性断裂.当加载速率增大到10mm/s时,其抗剪强度反而减小,断裂模式为发生在界面金属间化合物层的脆性断裂.另外,在加载速率较低时,抗剪强度随Ag元素含量的增加而增加;但在较高加载速率下,Ag元素含量为2%的钎料接头抗剪强度最低.

Effect of loading rate on shear strength and fracture mode of SnAgCu (SAC) lead-free solder joint was investigated.The Ag content of the solders used in the experiment was 1% to 3%.The loading rate of the solder joint was 0.01 mm/s to 10 mm/s.The results indicated that the shear strength increased with the increase of loading rate and fracture with ductile feature occured inside the solder,when the loading rate was less than 1 mm/s.When loading rate reached to 10 mm/s,the shear strength decreased and brittle fracture occured in the intermetallic compounds layer of joint.Moreover,shear strength increased with Ag content of solder increased at low loading rate,while the shear strength of solder joint with 2% Ag was the lowest at high loading rate.