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热导率测量系统的开发及应用 被引量:2

Development and application of the thermal conductivity tester
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摘要 根据一维稳态的导热原理自主研发了一套聚合物材料热导率(λ)的测量系统,适用范围λ=0~2W/(m.K)。该系统由机械子系统和控制子系统组成。机械子系统包含本体、加载模块、加热模块、冷却模块4部分,控制子系统包含温度传感器、热流传感器、PC和基于LabVIEW的图形化软件,实现了温度与热流量信号的采集、温度的控制及热导率等的显示输出。使用该系统实测了5种聚合物材料的热导率,实验测量值高于文献参考值+2%~+10%,其主要原因是样品上表面与加热盘下表面之间的存在热阻,略微降低了样品热端温度的测量值。 A new apparatus to measure the thermal conductivity of materials has been designed and manufactured based on the one-dimensional steady state method of the heat transfer.It includes a mechanical and control unit for the polymer materials with the thermal conductivity form 0 to 2 W/(m·K).The mechanical unit contains a body,a loading module,a heating module and a cooling module,while the control unit consists of two thermocouples,a heat flux sensor,PC and software.The apparatus realizes the acquisition of the heat flux and temperature,the temperature control and the display of thermal conductivity etc.Five polymer materials have been tested to verify the functions and liability of the apparatus.The testing results have a higher values of +2%~+10% than the standard values since the thermal resistance existing between the heat plate and sample deduces the temperature of hot end in the sample slightly.
出处 《电子测量技术》 2010年第9期22-25,51,共5页 Electronic Measurement Technology
基金 教育部新世纪优秀人才计划项目(NCET070535) 上海市科委项目(09DZ1141502) 上海大学研究生创新基金(SHUCX102208)资助
关键词 热导率测量系统 稳态法 聚合物材料 thermal conductivity tester steady state method polymer materials
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参考文献11

  • 1HOLMAN J P.Heat transfer[M].Beijing:China machine Press,2005:1-2.
  • 2SUHIR D,Thermally induced IC pacλage cracking[J].IEEE Trans.Comp.Hybrids Manuf.Technol.1990,13:940-945.
  • 3SERGENT J,KRUM A.Thermal Management Handbook for Electronic Assemblies[M].McGraw Hill,1998.
  • 4STERANKA F M,et al.High Power LEDs Technology Status and Market Applications[J].Phys.Stat.Sol.(a),2002,94(2):380-388.
  • 5闵凯,刘斌,温广.导热系数测量方法与应用分析[J].保鲜与加工,2005,5(6):35-38. 被引量:54
  • 6万闪闪,陆琳,张辉,唐慕萱.稳态平板导热仪最优预热时间的确定[J].热科学与技术,2006,5(2):180-183. 被引量:7
  • 7SLIFKA A J.Thermal-conductivity apparatus for steady state,comparative measurement of ceramic coatings[J].Journal of Research of the National Institute of Standards and Technology,2000,105(4):591-605.
  • 8WANG H,DINWIDDIE R B.Reliability of laser flash thermal diffusivity measurements of the thermal barrier coatings[J].Journal of Thermal Spray Technology,2000,9(2):210-214.
  • 9FALAT T,PLATEK B,TESARSKI S.An approach to measurement and evaluation of the thermal conductivity of the thermal adhesives in electronic packaging[C].32nd International Spring Seminar on Electronics Technology,Brno 2009.
  • 10CHUNG D D L.Polymer matrix composites for microelectronics[J].Polymer and Polymer Composites,2000,8(4):219-229.

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