摘要
研究了Sn3.5Ag/Cu界面金属间化合物层(IMC)生长演变规律及界面迁移机理。结果表明,随着热老化时间的延长,IMC层逐渐变厚,并且Cu_3Sn的生长速度快于Cu_6Sn_5,整个化合物层的生长速度逐渐放缓。通过分析Cu的溶解量、化合物的生长,发现IMC同时向Sn3.5Ag和Cu两端生长。由于Cu_3Sn/Cu_6Sn_5界面反应逐渐趋于平衡,该界面的迁移逐渐放缓。
The growth and evolution rule of intermetallic compounds layer at the interface of Sn3.5Ag/Cu and the mechanism of interface migration were studied. The results show that the intermetallic compounds layer becomes thicker with increase of the thermal aging time being, and the growth rate of Cu3Sn is faster than that of Cu6Sn5 ,and the growth rate of the IMCs layer is gradually becoming slow. It is found that the IMCs grow to both Sn3.5Ag and Cu side at the same time by analyzing the dissolved quantity of Cu and the growth of compounds. Because the interface action of Cu3Sn/Cu6Sn5 gradually approaches the equilibrium,and the migration on this interface gradually slows down.
出处
《焊接》
北大核心
2010年第9期39-42,共4页
Welding & Joining
