摘要
对CuO-磷酸盐胶粘剂有关粘接机理进行了剖析,提出CuO-磷酸盐胶粘剂调和固化后,主要生成含有“O-Cu-O”侧链,通过“-O-Cu-O-”链桥纵向和横向键合的无机磷酸盐高分子聚合物,是形成高强度粘接内聚力的主要因素,并经红外光谱证实。
The solidifying mechanism of copper oxide phosphate adhesive was explored. It was showed that polymerization of copper oxide phosphate adhesive results from the formation of “ O Cu O ” chain during the solidification. The high cohesive strength of copper oxide phosphate adhesive may be ascribed to cross linking of “ O Cu O ” chain in all directions. The above mentioned viewpoint was demonstrated by IR.
出处
《西北大学学报(自然科学版)》
CAS
CSCD
北大核心
1999年第3期229-232,共4页
Journal of Northwest University(Natural Science Edition)
关键词
氧化铜
胶粘剂
粘接机理
红外光谱
磷酸盐
copper oxide
phosphoric acid
adhesive
gluing mechanism
IR spectra