CuO-磷酸盐胶粘剂粘接机理

A study on solidifying mechanism of copper oxide phosphate adhesive

对ＣｕＯ－磷酸盐胶粘剂有关粘接机理进行了剖析，提出ＣｕＯ－磷酸盐胶粘剂调和固化后，主要生成含有“Ｏ－Ｃｕ－Ｏ”侧链，通过“－Ｏ－Ｃｕ－Ｏ－”链桥纵向和横向键合的无机磷酸盐高分子聚合物，是形成高强度粘接内聚力的主要因素，并经红外光谱证实。

The solidifying mechanism of copper oxide phosphate adhesive was explored. It was showed that polymerization of copper oxide phosphate adhesive results from the formation of “ O Cu O ” chain during the solidification. The high cohesive strength of copper oxide phosphate adhesive may be ascribed to cross linking of “ O Cu O ” chain in all directions. The above mentioned viewpoint was demonstrated by IR.