甲基磺酸锡光亮镀锡工艺研究

Study on the process of bright tin electroplating with tin methanesulfonate

研究了甲基磺酸锡(MSAS)、甲基磺酸(MSA)、电流密度、温度以及添加剂等工艺参数对甲基磺酸锡镀锡沉积速率的影响,确定的最优工艺条件为:MSAS90g/L,MSA140g/L,添加剂A(含酚类抗氧化剂和主光亮剂)25mL/L,添加剂B(含非离子表面活性剂和辅助光亮剂)6mL/L,温度30°C,电流密度5A/dm2。甲基磺酸锡镀锡沉积速率快,镀液的电流效率高,分散能力好,覆盖能力优良,镀层的耐氧化性能强,焊接性能和耐腐蚀性能优异。

The effects of the concentrations of tin methane-sulfonate and methanesulfonic acid,current density,temperature and additives on the deposition rate of tin electroplating were studied.The optimal conditions were determined as follows：tin methanesulfonate 90 g/L,methanesulfonic acid 140 g/L,additive A（composed of phenolic antioxidant and primary brightener） 25 mL/L,additive B（composed of nonionic surfactant and auxiliary brightener） 6 mL/L,temperature 30 °C and current density 5 A/dm2.The process features high tin deposition rate and current efficiency.The plating bath has good throwing power and covering power.The deposit has advantages of excellent oxidation resistance,weldability and corrosion resistance.