一种集成型双稳态微电磁继电器工艺及动态性能的研究

Fabrication Technology and Dynamic Characteristic of a New Type MEMS Bi-Stable Electromagnetic Relay

介绍了一种集成型双稳态微电磁继电器,利用金属基表面微加工技术和体微加工技术成功完成了弹簧和起气隙作用的SU-8垫片的集成制造.用Ansys和Matlab软件对其进行初步的研究设计仿真,证明了设计的可行性.并研究了该继电器的双稳态性能,分析了该微电磁继电器的动态特性,探讨了触点间产生碰撞的原因以及消除抖动的方法,为实现下一代体积更小、损耗更低、响应时间更短的继电器打下了良好的基础.

A new type MEMS bi-stable electromagnetic relay is presented.The bulk silicon micromachining and metal-based surface micromachining technology is used to fabricate this actuator.The parameters of the device are optimized by Ansys and Matlab software.The feasibility of the bi-stable characteristic is also studied.According to the characteristics of the relay＇s mechanical system,the relay＇s collision time was analyzed,and theory and test result were discussed.It is the foundation of the next generation of micro relay which has the property of smaller size,lower depletion and shorter response time.