摘要
对烧结式镍基板的真空化学浸渍过程及机理进行了研究。提出了计算浸渍量的数学式，并讨论了影响浸渍量的因素，提出解决后期没入率下降的新方法。
The process and mechanism of vacuum chemical impregnation were studied. The math equations for sintered Ni plaque were deduced to calculate the active material loading into the electrode. The reasons that affected the total Ni (OH)2 were discussed by analyzing the math equations. A new method was used to solve the problem that the impregnated Ni (OH)2 decreased in the late impregnation process.
出处
《电池》
CAS
CSCD
北大核心
1999年第2期57-60,共4页
Battery Bimonthly
基金
天津市科委攻关课题
