芳香胺类固化剂与环氧树脂的固化行为研究

Study on the Curing Behavior of Aromatic Amine Curing Agents with Epoxy Resin

研究了几种不同芳香胺固化剂与环氧树脂的固化性能,确定一种可用于覆铜板的芳香胺固化剂。通过凝胶化实验和DSC扫描的方式测试几种芳香胺类固化剂的反应活性,并测试了树脂浇铸体的介电性能。结果表明,MOCA固化剂综合性能优异,Ethacure100固化剂工艺性能优良,DDS固化剂固化温度比较高,使用起来相对比较困难。最后,选用Ethacure100固化剂固化酚醛环氧树脂,制备覆铜箔层压板(CCL),并测试板材的基本性能。

The curing property of several different aromatic amine curing agents and epoxy resin was studied,and one kind of aromatic amine curing agents which can be used on copper clad laminated（CCL） was determined.By gel-time experiments and DSC scan,the reactivity of several aromatic amine curing agents was investigated,and the dielectric properties of resin casting was tested.The result showed MOCA curing agent had good comprehensive properties,Ethacure 100 curing agent was excellent,and DDS curing agent need higher temperature to be cured,thus was difficult to be used.At last,novolac epoxy resin was cured by using Ethacure 100 as curing agent and CCL was prepared.And the property of CCL was tested.