低操作功真空开关触头材料的研究进展

Development of Contact Materials for Low-operating-power Vacuum Switches

小型化、高容量、智能化是真空开关发展的趋势,这对开关系统的操动机构提出了新的要求,低操作功真空开关应运而生。小型化、高容量、低操作功真空开关的发展很大程度上决定于触头材料性能的不断提高,低工作压力的真空开关要求触头在保证高的开断能力的同时必须具有低的熔焊倾向。笔者在展望低操作功真空开关开发前景的基础上,综述了低操作功真空开关触头材料的研究成果,提出新一代具有极高抗熔焊性能的CuCr系材料是低操作功真空开关触头的发展方向。

It is imperative for the further development of contact materials,which should have strong resistance to weld while keeping high breaking capacity,with the advances of miniaturization,high capacity and intelligence of vacuum switches.This paper summarized research results of the contact materials for the vacuum switches with low operating power.It put forward that the new generation of CuCr material with high anti-welding performance is the best potential contact for the low-operating-power vacuum switches.