MEMS封装技术及设备

MEMS Packaging Technology and Equipment

概述了进入后摩尔时代的MEMS技术,通过TSV技术整合MEMS与CMOS制程,使得半导体与MEMS产业的发展由于技术的整合而出现新的商机。主要介绍了MEMS器件封装所面临的挑战及相应的封装设备。

This paper overviews the MEMS technology of More than Moore era,through the integration of MEMS and CMOS technology with TSV process,making the emergence of business opportunities that development of semiconductor and MEMS industry based on the integration of technology.and introduces mainly the facing challenges of MEMS device package and its corresponding packaging equipment.