摘要
概述了元器件的分类及结构特点,详细阐述了无铅化后元器件镀层材料、可承受焊接温度、可焊性等各个方面的变化,同时对湿气敏感性、耐蚀性、晶须和可靠性等方面给出了质量评估方法,以保证无铅化电子组装的产品可靠性。
This article summarizes the type and features of component,and explants the change of finishing,solder temperature beared and solderability of component for lead-free in detail.At the same time the quality evaluation methods including MSL,corrosion resistance,tin whisker and reliability for component is put forward to ensure the assemble reliability.
出处
《电子工业专用设备》
2010年第9期23-32,共10页
Equipment for Electronic Products Manufacturing
关键词
无铅化
元器件
镀层
可焊性
可靠性
Lead-free
Component（SMC/SMD）
Finishing
Solderability
Reliability
