次磷酸盐化学镀铜体系主组份变化研究进展

Advances in the Change of Main Compositions of Electroless Copper Plating using Sodium Hypophosphite as Reducing Agent

随着对环境保护的重视,以甲醛为还原剂的化学镀铜体系将被环境友好型的化学镀铜体系所取代。以次磷酸盐为还原剂的化学镀铜体系环保、工艺参数范围大、镀液寿命长,可能成为下一步的研究热点。对次磷酸盐化学镀铜体系中主要组份含量变化对沉积速率和镀层性能的影响进行了综述,对其发展方向进行了展望。

With the attention of environmental protection,electroless copper plating using formaldehyde as reducing agent will be replaced by the environment-friendly plating bath.Electroless copper plating using sodium hypophosphite as reducing agent has the advantages of wide operation range,long-life of the electrolyte and harmless to the environment,and it might be the the research focus.The advances in the change of the main composition of the bath were overviewed.The direction of future development of the sodium hypophosphite plating bath was illustrated.