等离子印刷与电金属化相结合——一种经济成本较好的FPC制造新技术

Plasma-printing and Galvanic Metallization Hand in Hand——A New Technology for the Cost-efficient Manufacture of Flexible Printed Circuits

文章介绍了一种具有潜在经济效益的新技术,该技术结合大气压下介质阻挡放电图形处理方法(文章中称为"等离子印刷")和"电流电镀"的方法,该技术可以用于FPC的生产。该技术由行业界和学术界联合研究开发,主要是为了实现卷对卷(Reel-to-Reel)的生产工艺。至今为止,等离子印刷试验都是在实验室的设备上进行。因此,使用合适的等离子条件和化学镀镀液,能够生产线宽和间距达100μm的类似于RFID的标签和交叉指型的结构。经过剥离强度试验测定,由介质阻挡放电处理过的聚酰亚胺与铜箔的粘合强度可以达到大约1N/mm,类似DIN 53494中的描述。

A new potentially cost-efficient technology combing patterned atmospheric pressure dielectric barrier discharge（DBD） treatment,here referred to asplasma-printing,and galvanic plating for the production of flexible printed circuits（FPC） is presented in this contribution.The technology is being jointly developed by partners from industry and academia,a major aim being the realization of the processes in a reel-to-reel production system.So far,plasma-printing experiments have been carried out using lab-scale batch plants.Using suitable plasma conditions and electroless plating baths,RFID-like tag and interdigital structure with line widths and spaces down to 100μm could already be produced.Adhesion of copper on DBD treated polyimide foil reached up to about 1N/mm,as was determined in a peel test similar to that described in the DIN53494.