壳聚糖及复合物处理电镀铜废液中Cu^(2+)的研究

Treatment of Copper(Ⅱ) in Electroplating Wastewater by Chitosan and Compound Adsorbent

将40目石英砂与脱乙酰度为81.39%壳聚糖的1%醋酸溶液混合,制成复合吸附剂,用于去除电镀废液中的Cu2+。最佳工艺条件是:壳聚糖与石英砂质量比为1﹕18,吸附剂用量为15g/L,吸附时间为70min,pH值为6～9,废水中Cu2+质量浓度不大于200mg/L,对Cu2+的去除率为90%以上。石英砂-壳聚糖复合吸附剂与单纯的壳聚糖相比,吸附能力强、成本低、适用的pH范围广。

A compound adsorbent was prepared with the combination of chitosan and quartz sand.40 mesh quartz sand was added inchitosan slurry of 81.39% the degree of deacetylation to prepare adsorbent which mass ratio is 1：18.Its adsorptivity toward Cu^2＋ was studied and results showed that the dosage of the adsorbent is 15 g/L,the adsorption time is about 70min,the pH value is 6～9,the mass concentration of Cu（Ⅱ）in wastewater does not exceed 200 mg/L and Cu（Ⅱ） removal efficiency is 90%.Compared with the single chitosan,the adsorbent has a better adsorbility,low cost price and a wader pH value.