摘要
研究在磁控溅射工艺中工作压强和溅射时间恒定的情况下,溅射电流的变化对钛膜与基底Gd结合能力的影响。通过拉伸法测量薄膜与基体间的附着强度,利用扫描电镜观察Ti膜表面形貌。结果表明:溅射电流达到3 A时,Ti膜表面平整,与基体的结合力最强。由此说明,溅射电流的变化对钛膜与基底Gd结合能力的影响较大。
The effect of sputtering current on adhesion strength of Ti film and Gd basis when the working pressure and time is constant was discussed.The adhesion strength between the film and the basis was tested by tension test,and the surface was investigated by SEM.The results show that when the sputtering current reachs 3 A,the surface of the Ti film is smooth,and the adhesion strength with the matrix is the strongest.It can be concluded that the variation of the sputtering current has prominent effect on the adhesion strength between the Ti film and the Gd.
出处
《表面技术》
EI
CAS
CSCD
北大核心
2010年第5期92-94,共3页
Surface Technology
关键词
Ti膜
磁控溅射
溅射电流
附着强度
Ti film
magnetron sputtering
sputtering current
adhesion strength
