钛酸钡铅系半导瓷元件化学镀镍过程中之电性能变化机理

The mechanism of the variation of the electric performances of (Ba, Pb)TiO 3 ceramics in the course of electroless plating.

化学镀镍过程对ＰＴＣＲ及ＭＬＣＣ等元件的电性能，往往会产生负面效应，其中氢离子引起的还原作用不可忽视，其主要机理是增加了载流子浓度和改变了晶粒边界势垒。

Electroless nickel plating process often has a negative influence on the electric properties of PTCR's, MLCC's, etc. When reduction reaction caused by hydrogen atoms happens, the density of charge carriers increases and the grain boundary barrier changes. (4 refs.)