摘要
介绍了小型化混合微波集成电路(MHMIC)的制造工艺,列举了研制的几种典型的小型化混合微波集成电路(MHMIC)。与传统的混合微波集成电路(HMIC)相比,MHMIC具有体积小、重量轻、组装密度高、可靠性高、设计和调试灵活方便等显著优点。
The manufacture technology for microwave
HIC's is presented and some newly deve loped microwave HIC's are illustrated. Compare with the
typical microwave HIC's, The new ones are more compact, dense, reliable and easier to design
and adjust. (3 refs.)
出处
《电子元件与材料》
CAS
CSCD
1999年第3期30-32,共3页
Electronic Components And Materials
关键词
小型化
单片
微波集成电路
制造工艺
HMIC
microwave HIC's, thin film technology, thick film technology, single
chip IC's, wire bonding