亚胺型高分子应变材料的研究与应用

STUDY AND APPLICATION OF NEW IMIDE-TYPE POLYME RIC MATERIALS IN STRAIN

通过共聚共混法研制了用于制作和安装实验应力分析和传感器用耐高低温和塑性应变计的新型亚胺型基底胶和胶粘剂,同时介绍了获得优良性能材料的影响因素、工艺条件和基本特性以及初步应用结果。

The copolyamic acid (CPAA)and its blends was prepared by copolymerization in different solvents in order to raise the adhesion of polyimide (PI)and use as backing materials and adhesives of the strain gauge.The heat-resistant adhesives with wide range of plastic strain were developed. Their main characteristics arc as follows: imidization-cure condition, 60 min. at 280℃; operating temperature, -150～+300℃; elongation(post-yield, stra in limit), 8%; sensitivity(K), 1.85. M-type heat-resistant adhesives of thermosetting PI were studied in the installation of the strain gauge.