摘要
表面安装工艺流程的关键工序之一就是焊膏印刷，其控制直接影响着组装板的质量。通过对焊膏的特性、模板设计制造、以及印刷设备工艺参数的优化设定等，对焊膏印刷质量的控制作初步探讨。
In surface mount processes,stencil printing plays an important part,and the control has effect on the quality of assemblies.In the article,all the factors which control the stencil printing process,such as the characteristic of solder paste,design and manufacture of stencil,the optimization of variables for printer setting up and other issues are discussed.
出处
《电子工艺技术》
1999年第4期161-163,共3页
Electronics Process Technology
