摘要
回流焊温度控制是SMT中的重要技术。从回流焊工艺出发,提出了采用西门子PLC为控制核心,以模糊控制与PID控制相结合的控制方法实现回流焊的温度控制,利用MATLAB对系统进行了仿真,结果表明,基于模糊参数在线自整定的PID控制器系统超调量小,控制系统的动静态性能均得到改善,能够满足回流焊温度控制要求。
The temperature control of reflow soldering is an important technology in SMT.Proceeding from the reflow process,a method of fuzzy control combining with PID control to realize reflow soldering temperature control that controlled by SIMENS PLC controller,and the system is simulated with MATLAB.The simulation results indicate that the reflow soldering temperature with parameter self-tuning PID controller has high control precision,good dynamic and static performances,and the requirement of temperature control is satisfied.
出处
《机械设计与制造》
北大核心
2010年第10期220-221,共2页
Machinery Design & Manufacture
基金
信息产业部项目资助(2002XK440015)
