深亚微米多层互连的温度分布特性分析

Temperature characteristic analysis of multilevel interconnects in DSM

本文从热扩散方程出发,推导了简单互连的温度分布解析表达式,采用65nm工艺参数,详细讨论了热扩散长度和介质层厚度对互连温度分布的影响;进一步给出了复杂多层互连的温度分布解析表达式并用于其特性模拟,结果显示全局互连的温升远大于半全局互连和局部互连的温升。

In this paper, temperature distribution of simple interconnect is first derived based on the heat diffusion equation. Adopting parameters for 65nm process, the impacts of heat diffusion length and ILD thickness on temperature distribution are also discussed in detail. Then, the compact temperature distribution model of multilevel interconnects is derived and used for simulation. Results show that the temperature rise of global interconnects is quite larger comparing to the semiglobal and local interconnects.