新型微波毫米波单片三维垂直互连技术

New 3D Vertical Interconnect Technology with MMIC

近半个世纪以来,微波电路发展十分迅速,它经历了从低频到高频、从单层到多层的发展历程,最终导致了微波多芯片组件的产生。随着多芯片组件密度的不断提高,互连的不连续性成为制约整体性能的瓶颈。因此,对互连进行仿真和建模,对于微波多芯片组件的设计有着重要的意义。文章以MMIC芯片和介质基板的垂直互连结构作为研究对象,对不连续性结构的散射参数进行了软件仿真优化,并进行了装配、测试和结果分析。

During the last half century, it is rapidly developing of microwave circuit technique either from low frequency to high frequency or from single layer to multiple layers that leads to the coming of microwave multi-chip module （MMCM）. With the increasing density of multi-chip module, the discontinuity of interconnect is the choke point which restrains its integral performance. Hence, it is significant for the design of MMCM to simulate and model of interconnect. The work in this dissertation is, focused on the problem of vertical via interconnect with MMIC and circuit board, to fulfill software simulation on via＇s scattering parameter, fabricate, test, analyze the data.