SOT82封装产品的研发和制造

SOT 82 Production Development and Manufacture

文章介绍了SOT82封装产品研发历程以及在开发过程中出现的各种技术问题,通过原因分析并采取相应的措施,顺利地解决了这些问题。同时根据产品结构特点,在解决问题的同时给出了该产品大批量生产时的工艺条件、重点控制项目、方法、频度、设备的控制要点等,攻克了DVT热阻测试高、锡层厚度不稳定、脱口、载芯板变形、塑封体顶针角度偏移、塑封体段差不良等问题,顺利地实现了批量生产。装配后产品技术指示达到国际先进水平,产品质量稳定。

This course introduces SOT82 packaging product research and development process in all kinds of technical problems, and through the analysis of the causes and adopt corresponding measures, successfully solve these problems. According to the product structure characteristics, we also set up mass production technology conditions in all process, key control project, the method, the frequency, control key point of equipment etc. conquer dVT thermal resistance test, solder thickness unstable, wire peeling, leadframe distortion, thimble angle excursion etc., successfully realized mass production. The assembly product technical indicator has reached the international advanced level, product quality is stable and customers are satisfied.