SMT印刷电路板组件脆值的计算机仿真分析系统探讨

The Study of the Computer Simulation Analysing System of the SMT PCB Components's Frailty Xi'an University of Technology

针对一种典型的电子产品ＳＭＴ印刷电路板组件，提出了一种非破坏性的脆值评价方法，即采用计算机仿真技术进行分析。

At present,the main method of evaluating the frailty of products is the frailty experiment, which will lead to the destruction of the products. This paper proposes a no destruction method in accordance with a typical electronic productSMT PCB components, namely using computer simulation analysis technology.