太阳电池用Si片切割过程中浆料作用研究

Research on Slurry in the Cutting Process of Si Wafer for Solar Cell

Si片生产技术及工艺的进步使得太阳电池用Si片的切片厚度不断降低,而超薄的太阳电池用Si片必须通过多线切割机进行切割。基于Si片切割过程中砂浆性能对Si片表面质量、Si片成片率和切割线寿命的影响,分析了多线切割机中切削液的性能,并采用不同工艺参数多次进行试验,总结出了砂浆对太阳电池用Si片切割状态的影响因素。通过分析,得出了改善砂浆性能来提高多线切割机切片性能并获得更高的Si晶片表面质量的方法。

The wafer production technology and process make the solar energy wafer thickness become thinner and thinner.The ultrathin Si wafer cutting must be done by multi-wire saw.Based on the effects of slurry performance on the wafer surface quality,yields and cutting wire life in the cutting process of Si ingot,the multi-wire saw slurry performance was analyzed,and experiments were carried out with different parameters to test the infection of cutting slurry for wafer cutting states.By analyzing the infection factors,the methods for improving slurry performance to guarantee Si wafer surface quality were given.