固结金刚石线锯锯切硅片的正交试验研究

Orthogonal Experimental Research on Cutting of Silicon with Fixed Diamond Wire Saw

对固结金刚石线锯锯切硅片的工艺参数进行了正交试验研究。分析了工件进给速度、锯丝线速度和锯丝张紧力对硅片表面粗糙度的影响,获得了基于降低硅片表面粗糙度的最佳工艺参数。在本试验范围内,最佳工艺参数为：工件进给速度为0.5 mm/min,锯丝张紧力为0.22 MPa,锯丝线速度为1.5~1.8 m/s。

The orthogonal experimental research on cutting of silicon is reported in this paper.The effects of workpiece feed speed,the linear velocity and tension of the wire saw on surface roughness are analyzed.The optimized cutting parameters are obtained.The optimized parameters based on the experiment are 0.5mm/min workpiece feed speed,0.22MPa tension of the wire and 1.5~1.8m/s linear velocity of the wire saw.