一种基于BCB键合技术的新型MEMS圆片级封装工艺

Novel MEMS WLP Process Using BCB Bonding Technique

苯并环丁烯(BCB)键合技术通过光刻工艺可以直接实现图形化,相对于其他工艺途径具有工艺简单、容易实现图形化的优点。选用4000系列BCB材料进行MEMS传感器的粘接键合工艺试验,解决了圆片级封装问题,采用该技术成功加工出具有三层结构的圆片级封装某种惯性压阻类传感器。依据标准GJB548A对其进行了剪切强度和检漏测试,测得封装样品漏率小于5×10-3Pa.cm3/s,键合强度大于49N,满足考核要求。

The benzocyclobutene（BCB）bonding technique can pattern directly by lithography process.This method is more simple and easier than other approaches.A novel MEMS wafer level package method was achieved by BCB bonding technique with the BCB 4000 as a bonding material.A kind of the inertial piezoresistive sensor with three-layer structure was fabricated through the process.The WLP structure was tested and analyzed according to the GJB548A.The results show that the leak rate is less than 5×10-3 Pa·cm3/s,the bonding strength is larger than 49 N,and all samples have passed the test.